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Launch Your Fabless Future | EuroCDP Venture Building Programmes
EuroCDP Live-Webinar
EuroCDP is launching its Venture Building Programmes, a dedicated acceleration and incubation track designed to help European fabless startups move faster, design smarter, and scale with confidence.
Through these programmes, startups gain structured access to IC design tools, expert support, and a growing network of partners committed to strengthening Europe’s semiconductor ecosystem.
Join us for this live webinar to learn:
- What the EuroCDP Venture Building Programmes offer
- How startups can benefit from structured support in chip design
- How competence centres can help guide startups within their national ecosystems
- How to get involved in the programme
Who should attend:
- Fabless startups at any stage of chip design
- Chips competence centres supporting companies in their national ecosystems
- Accelerators and investors active in the semiconductor space
ECS Summer School – Apply now! | 23-28 August 2026
ECS Summer School – Apply now!
23-28 August 2026 | University Residential Centre, University of Bologna, Bertinoro, Italy
Microelectronics is at the heart of today’s digital transformation. From integrated circuit (IC) design and semiconductor technology to embedded intelligence and system integration, microelectronics enables innovation across telecom, automotive, biomedical devices and space applications.
The Microelectronics Summer School 2026 offers undergraduate STEM students a unique opportunity to explore this dynamic field through lectures, demonstrations and interactive sessions. The program covers:
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Semiconductor Technology
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Integrated Circuits Design
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Digital Systems & Embedded Intelligence
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System Integration
Sessions will be delivered by experts from leading universities, research institutes and industry. Career insights from young engineers will complement the technical program.
Eligibility: Undergraduate students (minimum two years completed) enrolled at a university in the EU or associated country.
Language: English
Cost: Free of charge (accommodation and meals included; travel not reimbursed).
Application deadline: 29 March 2026
👉 More information and application details: ECS Summer School
This Summer School is organised via chipsacademy.eu
This was EBSCON 2025
The leading trade fair for the European semiconductor and electronics industry on October 8, 2025, was for the first time part of EBSCON WEEK and focused thematically on “Creative Destruction.” As part of EBSCON 5.0, representatives of European Chips Competence Centres (CCC) signed the “Declaration of Graz” to strengthen Europe-wide collaboration.
Funding Opportunities at a Glance
On May 7, experts from BDO Austria and the SILICON ALPS Cluster gathered for a virtual “Coffee & Croissant” at the Online Funding Breakfast. The event provided a comprehensive overview of current funding opportunities at both national and European levels. At the heart of the discussion was the question of how companies can strategically leverage funding to drive innovation projects forward and strengthen resilience, even in economically challenging times.
Submit your project idea now and shape the future.
Use our submission form to bring your innovation to AT-C³ – we’ll support you from concept to realization.