European Semiconductor Collaboration Days

The two-day program brought together industry representatives, SMEs, research organizations, Chips Competence Centers (CCCs), and policymakers to strengthen connections across Europe’s semiconductor ecosystem.

Networking, Matchmaking and Collaboration Opportunities

A central objective of the event was to facilitate new partnerships and increase visibility for organizations active in microelectronics and semiconductor innovation. Through presentations, stakeholder pitches, poster sessions, and dedicated matchmaking activities, participants explored opportunities for future cooperation, technology exchange, and joint projects.

Representatives from several European Chips Competence Centers, research institutions, startups, and industrial companies contributed insights into semiconductor design, advanced packaging, pilot line access, and innovation support services.

Supporting Europe’s Semiconductor Future

The event highlighted the growing importance of cross-border collaboration in achieving the goals of the European Chips Act. Particular attention was given to heterogeneous integration and advanced packaging technologies, which are becoming increasingly important for next-generation chip systems and chiplet-based architectures.

By connecting emerging and established semiconductor regions, the European Semiconductor Collaboration Days 2026 reinforced the importance of a strong, interconnected European innovation network and demonstrated how cooperation can accelerate Europe’s competitiveness in microelectronics and semiconductor technologies.