NEWS & EVENTS FROM AT-C³
Updates & Insights from AT-C³
Discover information on project progress, achieved milestones, research activities and events from AT-C³.
14. July 2026
Webinar 30 July 2026: Building the Materials Platform for the Future of Integrated Photonics
In this Chips Think Tank webinar on July 30, 2026, Jean-Louis Guyaux, VP Technology at Riber, will share how one of Europe’s leading epitaxy equipment manufacturers is evolving from supplying MBE systems to enabling complete materials platforms for integrated photonics.
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8. July 2026
AT-C³ Joins the First Event of Intent to Foster Innovation & Startup Collaboration
AT-C³ was pleased to participate in the first Event of Intent at NAPO on the Campus Inffeld of the Graz University of Technology. The new networking format brought together around 40 participants from startups, scaleups and established companies with one clear goal: transforming conversations into concrete collaborations.
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26. June 2026
ITF World 2026 – A Recap
More than 2,000 international technology and AI leaders gathered in Antwerp for IFT World, organized by imec under the theme “Strategic paths to an AI-Defined Future.”
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17. June 2026
European Semiconductor Collaboration Days
On 4–5 June 2026, stakeholders from across the European semiconductor value chain gathered in Budapest for the European Semiconductor Collaboration Days 2026.
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8. June 2026
PODIM 2026 – A Recap
PODIM 2026 ran from May 11–13, with May 11 as a pre-conference day and May 12 and 13 as the two main conference days. The “second day” of the event proper is May 12. Here’s a breakdown of what happened, and how Infineon was involved.
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10. January 2026
This was EBSCON 2025
The leading trade fair for the European semiconductor and electronics industry on October 8, 2025, was for the first time part of EBSCON WEEK and focused thematically on “Creative Destruction.” As part of EBSCON 5.0, representatives of European Chips Competence Centres (CCC) signed the “Declaration of Graz” to strengthen Europe-wide collaboration.
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All dates and events at a glance.
We tested SLAMLab, our in-house SLAM solution at AIT Austrian Institute of Technology, with Ouster's new Revision 8. Every lidar point now has a real color, straight from the sensor.No more transferring color from separate cameras, which meant calibration and mismatched viewpoints. Now color and geometry come from the sensor together: every point colored, perfectly aligned.The same data also comes as an RGB image (256×2048 at 10 Hz rotation, or 256×4096 at 5 Hz), so vision AI models can run directly on it to interpret the scene.Essentially a multi-sensor system in a single device: lidar + camera + IMU (640 Hz!)This is a public Yosemite dataset from Ouster's sample library, processed with SLAMLab. It fuses lidar with the built-in IMU to create the map in real time – a fully colored 3D point cloud.Videos of both datasets we processed:- Yosemite: – Chinatown: Sample data: More about Revision 8: #SLAM #LiDAR #Robotics #MobileMapping #PointCloud #SLAMLab #AIT #Ouster
Terumo completes first procedure with Opuswave dual sensor system
Terumo Interventional Systems (TIS) has reported the first clinical use of its Opuswave Dual Sensor Imaging System in the US.
ERA and Airbus integrate passive sensor data for next-gen Air Defence – France
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Sub-10-nm-Strukturen sind direkt in MEMS-Sensoren integriert
(Bild: Hochschule RheinMain) Mikrosysteme (MEMS) sind das Rückgrat der Prozessmesstechnik. Doch die Anforderungen, getrieben durch die Energiewende, reicht die Mikrometer-Skala oft nicht aus. Wissenschaftler der Hochschule RheinMain (HSRM) haben nun eine Technologieplattform vorgestellt, die Nanostrukturen direkt in MEMS integriert.
Aeva adopts Cadence Tensilica Vision DSP to boost lidar performance
Cadence Tensilica Vision DSPs deliver a unique combination of programmability and performance, enabling Aeva to add flexibility, scalability and customizations to the lidar processing pipeline.
Infineon introduces the AIROC™ UWB TSL100 for precise | Infineon Technologies
Infineon introduces the AIROC™ UWB TSL100 for precise positioning and smart presence detection on a single chip
Infineon presents microcontroller and sensor solutions | Infineon Technologies
Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026
Robust.AI chooses Aptiv PULSE sensor for Gen 3 Carter mobile robot – The Robot Report
Aptiv provides sensor fusion from radar and vision using AI to enable Robust.AI’s Carter robot to move safely around people.
SERS-Sensoroberflächen mit sulfatgeführtem Silber für stabiles Medikamentenmonitoring
Forscher am Leibniz-IPHT entwickeln sulfatgelenkte Silber-Dendriten für SERS: stabile Raman-Sensoroberflächen, die Blutplasma-Medikamentenspiegel für fünf Wirkstoffe auch nach Monaten präzise erfassen.
Sony Semiconductor Solutions bringt einen fortschrittlichen 1/2-Zoll-CMOS-Sensor für mobile Anwendungen auf den Markt, der über die branchenweit erste RB2×2-OCL-Pixelstruktur verfügt, die sowohl eine hohe Auflösung als auch eine hervorragende Autofokus-Le
24.06.2026 – Das neue Pixeldesign und der neue Algorithmus sorgen für eine um mehr als 20 % höhere Auflösung im Vergleich zu herkömmlichen Produkten von Sony.ATSUGI, Japan, 24. Juni 2026 /PRNewswire/ – Die Sony Semiconductor Solutions Corporation (Sony) gab …
Drive Group and Innoviz Sign Strategic Collaboration to Advance AI-Powered LiDAR Solutions for Security and Intelligent Transportation
/PRNewswire/ — Drive Group, comprising six leading transportation and infrastructure companies in Israel, and the technology company Innoviz Technologies Ltd….
Distance-Aware DBSCAN–STM Pipeline with Centralized Point Augmentation for LiDAR-Based Pedestrian Candidate Generation
This paper presents a non-learning-based, seed-dependent, semi-automatic pedestrian candidate generation pipeline for LiDAR point clouds. The proposed method is designed to support 3D annotation workflows by reducing irrelevant candidate clusters while improving the reliability of pedestrian candidate selection under distance-dependent point sparsity. The pipeline integrates distance-aware DBSCAN clustering, Single Template Matching (STM), and Centralized Point Augmentation (CPA). First, LiDAR points within the camera field of view are preprocessed, and pedestrian candidate clusters are generated using DBSCAN parameters configured according to distance intervals. Ground-snapping-based bounding-box refinement and height-based filtering are then applied to improve geometric consistency and reduce non-pedestrian candidates. In the second stage, STM compares PCA-aligned projected silhouettes of candidate clusters with a seed pedestrian template to suppress false positives. To address silhouette instability caused by sparse mid-range pedestrian points, CPA adds centroid-contracted points in the projection-relevant plane before template matching. Experiments on pedestrian-containing frames from the KITTI dataset show that STM improves precision from 27.6% to 60.5% and increases the F1-score from 36.8% to 51.4% compared with the initial DBSCAN-based candidate generation stage. The final CPA configuration improves recall from 44.7% to 46.7% and the overall F1-score from 51.4% to 52.1%, while revealing a precision–recall trade-off. Supplementary IoU analysis shows that the final DBSCAN–STM–CPA configuration maintains meaningful spatial overlap with pedestrian ground-truth boxes, achieving 88.9% at 3D IoU ≥ 0.10 and 81.6% at BEV IoU ≥ 0.25. Runtime analysis further shows that height-based filtering reduces the average per-frame processing time from 151.5 ms to 125.1 ms, while the final CPA configuration introduces only a small overhead, resulting in 126.2 ms per frame. These results demonstrate that the proposed DBSCAN–STM–CPA pipeline can provide reliable pedestrian candidates for semi-automatic 3D labeling without requiring class-specific detector training.
STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industry-leading resolution and performance – ST News
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the…
𝗖𝗮𝗻 𝗮 𝗿𝗼𝗯𝗼𝘁 𝘁𝗿𝘂𝗹𝘆 “𝗳𝗲𝗲𝗹”? At the EMEA Humanoid Robot Summit in Munich this week, machine perception proofed to be key to meaningful interaction. In his presentation on “Humanoid robot electronic skin and interaction perception” our expert Clemens Müller focused on a key enabler: the fusion of photonics and electronics. By combining these technologies, robots can go beyond simple detection — gaining the ability to:🔹See with precision through advanced optical solutions🔹Feel physical interaction via touch and proximity sensing🔹Interpret context using integrated sensor data🔹Interact safely and intuitively with humans This “electronic skin” concept unlocks a new level of perception, allowing humanoid robots to operate more naturally in human environments from collaboration to real-time responsiveness.A strong step toward bridging the gap between human and machine interaction. To read more about our humanoid robots, visit #Robotics #HumanoidRobot #HumanMachineInteraction #amsOSRAM #amsOSRAMIndustrial
Präzise und leise, wie die MinebeaMitsumi Smart City Sensor Nodes Straßen fühlbar smarter machen
Die Smart City Sensor Nodes von MinebeaMitsumi lauschen dem Verkehr, messen Umweltwerte und liefern
𝗛𝗼𝘄 𝗶𝘀 𝗱𝗶𝗴𝗶𝘁𝗮𝗹 𝗽𝗵𝗼𝘁𝗼𝗻𝗶𝗰𝘀 𝗿𝗲𝘀𝗵𝗮𝗽𝗶𝗻𝗴 𝘁𝗵𝗲 𝗳𝘂𝘁𝘂𝗿𝗲 𝗼𝗳 𝘁𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝘆? In a recent interview with China Daily, Conrad Rodriguez, Executive Vice-president of Global Sales for ams OSRAM shared how ams OSRAM is evolving into a pure-play leader in digital photonics—where light is no longer just for illumination, but also for sensing, communication, and interaction. From intelligent automotive lighting and spectral sensing to AR displays, robotics, drones, and data centers, the convergence of emitters, sensors, and digital processing is unlocking a new generation of smarter optical solutions. As Conrad noted: "China is a central pillar of the digital photonics story." With its fast-paced innovation ecosystem and leadership across automotive, consumer electronics, industrial, and medical technologies, China continues to play a pivotal role in shaping our next growth chapter."Under its '𝗶𝗻 𝗖𝗵𝗶𝗻𝗮, 𝗳𝗼𝗿 𝗖𝗵𝗶𝗻𝗮' strategy, ams OSRAM has been dedicated to building a locally based and globally supported industry chain in China to better understand and respond to rapidly changing market demands. A value chain covering development, purchasing, manufacturing and management has been established in the country, according to Kevin Shi, vice-president of the Greater China & Rest of Asia Region at ams OSRAM. Read the full interview in China Daily: China as central pillar of ams OSRAM's next growth chapter:
Die Bundesregierung setzt ein klares Signal: Mit 340 Millionen Euro für die ESA-Periode 2026–2028 steigert Österreich sein Engagement im Weltraumsektor um 30 Prozent. Bundesminister Peter Hanke und FFG-Geschäftsführerin Karin Tausz präsentierten die Strategie, die SpaceTech als Schlüsseltechnologie der Industriestrategie 2035 positioniert. Rund 200 österreichische Unternehmen – darunter Hidden Champions in Sensorik und Robotik – erwirtschafteten 2022 bereits 209 Millionen Euro.
Europe's first superconducting X-ray spectrometer uses 248 sensors – Europe
Researchers in Germany have brought Europe’s first and only superconducting TES-array X-ray spectrometer online at the BESSY II synchrotron, a leading
KAIST Creates Next-Generation Self-Powered Wearable Sensor withstanding
In a groundbreaking advancement that promises to reshape the landscape of wearable technology and soft robotics, researchers at the Korea Advanced Institute of Science and Technology (KAIST) have
New "electronic nose" uses 16 sensors to detect food spoilage
UC Berkeley researchers built an electronic nose that uses carbon nanotube sensors and AI to detect food spoilage and identify allergens.
AIT entwickelt nachhaltige Biosensoren zur Krebserkennung
Neuartige Sensoren ermöglichen eine präzise molekulare Diagnostik aus Blutproben, die effizienter, ressourcenschonender und breiter zugänglich ist als derzeitige Laborverfahren.
Swallowable ‘blueberry’ sensor could transform how we monitor body temperature
A tiny electronic sensor that can be swallowed like a pill may soon provide one of the most accurate ways to measure body temperature. Engineers at the Massachusetts Institute of Technology (MIT) have developed a miniature device that continuously monitors temperature from inside the digestive tract, potentially helping doctors detect infections earlier and better manage […]
MAHLE and Rohde & Schwarz Develop Application for Sensor Testing of Modern Driver Assistance Systems – CBNT CHANNEL
Technology groups MAHLE and Rohde & Schwarz have jointly developed a technical application that, for the first time
A tiny ingestible sensor can measure temperature from inside the body
MIT engineers developed a tiny ingestible sensor that can send continuous temperature updates from the GI tract.
Sensor+Test 2026: Technologien für präzise Daten und Analysen
Die Sensor+Test hat vom 9. bis 11. Juni 2026 in Nürnberg erneut Fachbesucher aus den Bereichen Sensorik, Mess- und Prüftechnik zusammengebracht. Mit ihrer Fokussierung auf diese Kerntechnologien und der gleichzeitigen Vielfalt an Anwendungsfeldern bietet die Messe einen umfassenden Überblick über aktuelle Entwicklungen und Trends der Branche. Im Mittelpunkt stehen dabei Technologien, die die Gewinnung und Nutzung von Messdaten in Industrie, Forschung und Entwicklung ermöglichen.
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